MediaTek Announces Dimensity 800 Chipset with Integrated 5G Modem

MediaTek 5G modem

MediaTek has announced new Dimensity 800 chipset which it hopes will compete with Huawei’s Kirin 800 series and Qualcomm’s Snapdragon 7 series. This announcement was made at a quick press conference in Beijing and the company hopes to have it powering mid-range devices in 2020.

The specifications have not yet been revealed but the chipset will be coming with an integrated 5G modem. It is expected to be a good alternative to the Dimensity 1000/L found in Oppo Reno3. At the press conference, it was announced that a performance demo will be shown at the 2020 CES which will be taking place in Las Vegas.

Dimensity 800 chipset announcement

From what is known so far; its modem is Helio M70. It has a download speed which can go as high as 4.7Gbps and a 2.5Gbps of uplink. It comes with support for SA and NSA networks and is NR 2 Component Carrier compliant.


In terms of speed, the chipset comes with four Cortex-A77 and four Cortex-A55 cores. According to MediaTek, it brings up to 20% improvement performance-wise and battery life when compared to chipsets running the Cortex-A76.


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